Invention Grant
- Patent Title: Semiconductor device structure with high voltage device
-
Application No.: US16173721Application Date: 2018-10-29
-
Publication No.: US10892360B2Publication Date: 2021-01-12
- Inventor: Hung-Chou Lin , Yi-Cheng Chiu , Karthick Murukesan , Yi-Min Chen , Shiuan-Jeng Lin , Wen-Chih Chiang , Chen-Chien Chang , Chih-Yuan Chan , Kuo-Ming Wu , Chun-Lin Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/06 ; H01L29/423 ; H01L29/40

Abstract:
A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
Public/Granted literature
- US20190165167A1 SEMICONDUCTOR DEVICE STRUCTURE WITH HIGH VOLTAGE DEVICE Public/Granted day:2019-05-30
Information query
IPC分类: