Invention Grant
- Patent Title: Embedded sensor module and sensing device
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Application No.: US15843435Application Date: 2017-12-15
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Publication No.: US10895561B2Publication Date: 2021-01-19
- Inventor: Jung-Hao Wang , Che-Hsin Lin , Wei-Sin Kao , Pai-Hao Wu , Chen-Hua Chu , Cheng-Hung San
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G01N33/00
- IPC: G01N33/00 ; G01F1/684 ; G01N33/18 ; G01N27/06
Abstract:
An embedding sensor module includes a cylinder and at least one flake sensor. A fluid tank is surrounded by the cylinder. The cylinder has a plurality of orifice connected to the fluid tank. The flake sensor is embedded in the fluid tank.
Public/Granted literature
- US20190187112A1 EMBEDDING SENSOR MODULE AND SENSING DEVICE Public/Granted day:2019-06-20
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