Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity
Abstract:
A substrate processing system includes model generation and setpoint modules. The model generation module receives a first time trace based on an output of an endpoint sensor and obtains a target setpoint. A portion of the first time trace is indicative of an endpoint at which a feature has been created in a first substrate. The target setpoint is generated based on a metrology process and is used to compensate for erosion of a first edge ring. The model generation module generates a conversion model based on the portion and the target setpoint. The setpoint module: based on the output, receives a second time trace that is generated subsequent to generation of the first time trace; and based on the conversion model, converts the second time trace to a predicted erosion compensation setpoint, which is set while processing a second substrate using the first or a second edge ring.
Information query
Patent Agency Ranking
0/0