Invention Grant
- Patent Title: Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity
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Application No.: US16214861Application Date: 2018-12-10
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Publication No.: US10903050B2Publication Date: 2021-01-26
- Inventor: Luc Albarede , Yassine Kabouzi
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/66 ; H01L21/67

Abstract:
A substrate processing system includes model generation and setpoint modules. The model generation module receives a first time trace based on an output of an endpoint sensor and obtains a target setpoint. A portion of the first time trace is indicative of an endpoint at which a feature has been created in a first substrate. The target setpoint is generated based on a metrology process and is used to compensate for erosion of a first edge ring. The model generation module generates a conversion model based on the portion and the target setpoint. The setpoint module: based on the output, receives a second time trace that is generated subsequent to generation of the first time trace; and based on the conversion model, converts the second time trace to a predicted erosion compensation setpoint, which is set while processing a second substrate using the first or a second edge ring.
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