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公开(公告)号：US10784174B2
公开(公告)日：2020-09-22
申请号：US15783301
申请日：2017-10-13
发明人： Yassine Kabouzi , Luc Albarede
IPC分类号： H01L21/66 , H01L21/67 , H01J37/32 , G01N21/3504 , H01L21/3065 , H01L21/311 , H01L21/3213
摘要： A method for processing a substrate in a processing chamber using at least one time trace based prediction model is provided. A substrate is dry processed, where the dry processing creates at least one gas by-product. A concentration of the at least one gas by-product is measured. A time trace of the concentration of the at least one gas by-product is determined. The determined time trace of the concentration is provided as input for the at least one time trace based prediction model to obtain at least one process output. The at least one process output is used to adjust at least one process parameter.
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公开(公告)号：US10157730B2
公开(公告)日：2018-12-18
申请号：US15194452
申请日：2016-06-27
IPC分类号： H01J37/32
摘要： A plasma system includes an RF generator and a matchbox including an impedance matching circuit, which is coupled to the RF generator via an RF cable. The plasma system includes a chuck and a plasma reactor coupled to the matchbox via an RF line. The RF line forms a portion of an RF supply path, which extends between the RF generator through the matchbox, and to the chuck. The plasma system further includes a phase adjusting circuit coupled to the RF supply path between the impedance matching circuit and the chuck. The phase adjusting circuit has an end coupled to the RF supply path and another end that is grounded. The plasma system includes a controller coupled to the phase adjusting circuit. The controller is used for changing a parameter of the phase adjusting circuit to control an impedance of the RF supply path based on a tune recipe.
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公开(公告)号：US09119283B2
公开(公告)日：2015-08-25
申请号：US13901509
申请日：2013-05-23
发明人： Luc Albarede
CPC分类号： H05H1/46 , H01J37/32183 , H01J37/32899 , H05H2001/4682
摘要： Systems and methods for performing chamber matching are described. One of the methods for performing chamber matching includes executing a first test within a first plasma chamber to measure a variable and executing a second test within a second plasma chamber to measure the variable. The first and second tests are executed based on one recipe. The method further includes determining a first relationship between the variable measured with the first test and power provided during the first test, determining a second relationship between the variable measured with the second test and power provided during the second test, and identifying power adjustment to apply to the second plasma chamber during a subsequent processing operation based on the first and second relationships. The power adjustment causes the second plasma chamber to perform the processing operation in a processing condition determined using the first plasma chamber.
摘要翻译： 描述了用于执行室匹配的系统和方法。 执行室匹配的方法之一包括在第一等离子体室内执行第一测试以测量变量并在第二等离子体室内执行第二测试以测量该变量。 第一个和第二个测试是基于一个配方执行的。 该方法还包括确定用第一测试测量的变量与在第一测试期间提供的功率之间的第一关系，确定用第二测试测量的变量与第二测试期间提供的功率之间的第二关系，以及识别要应用的功率调整 在后续处理操作期间基于第一和第二关系到第二等离子体室。 功率调整使得第二等离子体室在使用第一等离子体室确定的处理条件下进行处理操作。
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公开(公告)号：US20150091440A1
公开(公告)日：2015-04-02
申请号：US14043525
申请日：2013-10-01
IPC分类号： H01J37/32
CPC分类号： H01J37/32183
摘要： A system for controlling an impedance of a radio frequency (RF) return path includes a matchbox further including a match circuitry. The system further includes an RF generator coupled to the matchbox to supply an RF supply signal to the matchbox via a first portion of an RF supply path. The RF generator is coupled to the matchbox to receive an RF return signal via a first portion of an RF return path. The system also includes a switch circuit and a plasma reactor coupled to the switch circuit via a second portion of the RF return path. The plasma reactor is coupled to the match circuitry via a second portion of the RF supply path. The system includes a controller coupled to the switch circuit, the controller configured to control the switch circuit based on a tune recipe to change an impedance of the RF return path.
摘要翻译： 用于控制射频（RF）返回路径的阻抗的系统包括还包括匹配电路的火柴盒。 该系统还包括耦合到火柴盒的RF发生器，以经由RF供应路径的第一部分向火柴盒提供RF供应信号。 RF发生器耦合到火柴盒，以经由RF返回路径的第一部分接收RF返回信号。 该系统还包括经由RF返回路径的第二部分耦合到开关电路的开关电路和等离子体电抗器。 等离子体反应器经由RF供应路径的第二部分耦合到匹配电路。 该系统包括耦合到开关电路的控制器，该控制器被配置为基于调谐配方来控制开关电路以改变RF返回路径的阻抗。
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公开(公告)号：US10930478B2
公开(公告)日：2021-02-23
申请号：US15988411
申请日：2018-05-24
IPC分类号： H01J37/32 , H01L21/3065 , H01J37/22
摘要： An apparatus for processing a substrate is provided. A processing chamber is provided. A substrate support is within the processing chamber. A gas inlet provides a process gas into the processing chamber. A gas source provides the process gas to the gas inlet. An exhaust pump pumps gas from the processing chamber. A parameter measurement system comprises a cavity ring down device in fluid communication with the processing chamber, comprising a first cavity ring down mirror on a first side of the cavity ring down device and a second cavity ring down mirror on a second side of the cavity ring down device spaced apart from the first cavity ring down mirror. At least one laser light source is optically coupled to the first cavity ring down mirror. A light detector is optically coupled to either the first cavity ring down mirror or the second cavity ring down mirror.
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公开(公告)号：US10134569B1
公开(公告)日：2018-11-20
申请号：US15824061
申请日：2017-11-28
发明人： Luc Albarede , Yassine Kabouzi , Jorge Luque
摘要： A substrate processing system includes a processing chamber. A pedestal and a showerhead are arranged in the processing chamber. A surface plasmon resonance (SPR) fiber has a central portion disposed in the processing chamber, and opposing ends disposed outside the processing chamber. A light source provides input light at one end of the SPR fiber, and a detector receives output light from the other end of the SPR fiber. Surface plasmon waves and evanescent waves constitute the output light, which is processed and analyzed to determine a condition of the processing chamber.
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公开(公告)号：US20170084426A1
公开(公告)日：2017-03-23
申请号：US14863211
申请日：2015-09-23
发明人： Luc Albarede , Yassine Kabouzi
IPC分类号： H01J37/32
CPC分类号： H01J37/3244 , H01J37/32009 , H01J37/32715 , H01J37/32834 , H01J37/32963 , H01J37/32972 , H01J37/3299
摘要： An apparatus for processing a substrate is provided. A substrate support is located within a processing chamber. A gas inlet provides a process gas into the processing chamber. An exhaust pump pumps gas from the processing chamber. A gas byproduct measurement system comprises an IR light source and an IR detector. A controller comprises at least one processor and computer readable media. The computer readable media comprises computer readable code for flowing the process gas into the etch chamber, for processing data from the IR detector, for using the processed data from the IR detector for determining concentration of the gas byproduct, and for using the determined concentration of the gas byproduct for adjusting the flow of the process gas into the processing chamber.
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8.发明授权公开(公告)号：US09548189B2
公开(公告)日：2017-01-17
申请号：US14694356
申请日：2015-04-23
IPC分类号： H01J37/32
CPC分类号： H01J37/32963 , H01J37/32082 , H01J37/321 , H01J37/32449 , H01J37/32972 , H01J37/32981 , H01J37/3299 , H01J2237/334
摘要： A substrate etching system includes an etching control module, a filtering module, and an endpoint module. The etching control module selectively begins plasma etching of a substrate within an etching chamber. The filtering module, during the plasma etching of the substrate: receives a signal including endpoint information; decomposes the signal using empirical mode decomposition (EMD); and generates a filtered signal based on results of the EMD. The endpoint module indicates when an endpoint of the plasma etching of the substrate has been reached based on the filtered signal. The etching control module ends the plasma etching of the substrate in response to the indication that the endpoint of the plasma etching of the substrate has been reached.
摘要翻译： 衬底蚀刻系统包括蚀刻控制模块，过滤模块和端点模块。 蚀刻控制模块选择性地开始蚀刻室内的衬底的等离子体蚀刻。 过滤模块在衬底的等离子体蚀刻期间：接收包括端点信息的信号; 使用经验模式分解（EMD）分解信号; 并根据EMD的结果生成滤波信号。 端点模块基于滤波信号指示何时已经到达基板的等离子体蚀刻的端点。 响应于已经达到衬底的等离子体蚀刻的终点的指示，蚀刻控制模块结束衬底的等离子体蚀刻。
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公开(公告)号：US20140265833A1
公开(公告)日：2014-09-18
申请号：US13800381
申请日：2013-03-13
发明人： Luc Albarede
IPC分类号： H05H1/46
CPC分类号： H05H1/46 , H01J37/32183
摘要： Systems and methods for compensating for harmonics produced during plasma processing in a plasma chamber are described. One of the methods includes retrieving a measurement of a combined waveform. The combined waveform includes a fundamental waveform and a harmonic waveform. The combined waveform defines a voltage proximate to a surface of a chuck, which is coupled to a radio frequency (RF) transmission line. The RF transmission line is coupled to an impedance matching circuit. The impedance matching circuit is coupled to an RF generator. The method further includes extracting the fundamental waveform from the combined waveform, determining a difference between a magnitude of the combined waveform and a magnitude of the fundamental waveform, and controlling the RF generator to compensate for the difference.
摘要翻译： 描述了用于补偿等离子体室中的等离子体处理期间产生的谐波的系统和方法。 其中一种方法包括检索组合波形的测量。 组合波形包括基波和谐波波形。 组合波形定义了靠近卡盘表面的电压，其耦合到射频（RF）传输线。 RF传输线耦合到阻抗匹配电路。 阻抗匹配电路耦合到RF发生器。 该方法还包括从组合波形中提取基波形，确定组合波形的幅度与基波的大小之差，以及控制RF发生器来补偿差值。
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公开(公告)号：US20230230805A1
公开(公告)日：2023-07-20
申请号：US18009978
申请日：2021-10-15
IPC分类号： H01J37/32
CPC分类号： H01J37/32174 , H01J37/32146
摘要： Systems and methods for synchronization of radio frequency (RF) pulsing schemes and of sensor data collection are described. One of the methods includes receiving, by an RF generator, a first set of one or more variable levels and one or more duty cycles of an RF signal. The method further includes receiving, by the RF generator from a pulse controller, a synchronization signal having a plurality of pulses. The method also includes generating, during a clock cycle of a clock signal, multiple instances of a first plurality of states of the RF signal in synchronization with the plurality of pulses of the synchronization signal. Each of the first plurality of states of the RF signal has a corresponding one of the one or more variable levels of the first set and a corresponding one of the one or more duty cycles of the first set.
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