Invention Grant
- Patent Title: Light emitting device package
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Application No.: US16851354Application Date: 2020-04-17
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Publication No.: US10903397B2Publication Date: 2021-01-26
- Inventor: Yong Il Kim , Hyong Sik Won , Wan Tae Lim , Nam Goo Cha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0137334 20150930,KR10-2016-0086022 20160707
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/08 ; H01L27/15 ; H01L25/075 ; H01L33/44 ; H01L33/32 ; H01L33/38 ; H01L33/58

Abstract:
A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.
Public/Granted literature
- US20200243723A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2020-07-30
Information query
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