A semiconductor device package includes a first glass carrier, a package body, a first circuit layer and a first antenna layer. The first circuit layer is disposed on the first surface of the first glass carrier. The first circuit layer has a redistribution layer (RDL). The package body is disposed on the first circuit layer. The package body has an interconnection structure penetrating the package body and is electrically connected to the RDL of the first circuit layer. The first antenna layer is disposed on the second surface of the first glass carrier.