- 专利标题: Substrate liquid processing apparatus and substrate liquid processing method
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申请号: US15826886申请日: 2017-11-30
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公开(公告)号: US10916456B2公开(公告)日: 2021-02-09
- 发明人: Hironobu Hyakutake
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Pearne & Gordon LLP
- 优先权: JP2016-235382 20161202
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/306 ; H01L21/677 ; H01L21/673
摘要:
A substrate liquid processing apparatus includes a placing unit which places thereon a substrate; a liquid processing unit which processes the substrate by immersing the substrate in a processing liquid with a posture in which a plate surface of the substrate is perpendicular to a horizontal direction; a transfer unit which transfers the substrate between the placing unit and the liquid processing unit; and a rotating unit which rotates the substrate, after being subjected to a first processing by the liquid processing unit, around an axis perpendicular to the plate surface, and in a direction different from that when the first processing is performed. Further, the transfer unit transfers the substrate, after being subjected to the first processing, to the rotating unit and transfers the rotated substrate to the liquid processing unit. The liquid processing unit performs a second processing by immersing the rotated substrate in the processing liquid.
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