Invention Grant
- Patent Title: Packaged MEMS device with disturbance compensation
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Application No.: US15999017Application Date: 2018-08-20
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Publication No.: US10921206B2Publication Date: 2021-02-16
- Inventor: Benjamin Kollmitzer , Franz Michael Darrer , Philipp Greiner , Marcus Edward Hennecke , Walter Schuchter , Christoph Steiner
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Priority: DE102017214846.2 20170824
- Main IPC: G01L19/14
- IPC: G01L19/14 ; G01L9/06 ; G01L19/06

Abstract:
Disclosed is an apparatus which has, among other things, a MEMS device with a first measurement arrangement for capturing a measurement variable (X1) based on a physical variable, which has a useful variable component (N1) and a first disturbance variable component (Z1), and a second measurement arrangement for capturing a second disturbance variable component (Z2). The apparatus furthermore has a disturbance compensation circuit which is configured to combine the second disturbance variable component (Z2) and the measurement variable (X1) with one another and to obtain a disturbance-compensated measurement variable (Xcomp). The MEMS device is arranged in a housing, wherein the MEMS device is in immediate mechanical contact with the housing by way of at least 50% of a MEMS device surface.
Public/Granted literature
- US20190064026A1 PACKAGED MEMS DEVICE WITH DISTURBANCE COMPENSATION Public/Granted day:2019-02-28
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