Packaged MEMS device with disturbance compensation
Abstract:
Disclosed is an apparatus which has, among other things, a MEMS device with a first measurement arrangement for capturing a measurement variable (X1) based on a physical variable, which has a useful variable component (N1) and a first disturbance variable component (Z1), and a second measurement arrangement for capturing a second disturbance variable component (Z2). The apparatus furthermore has a disturbance compensation circuit which is configured to combine the second disturbance variable component (Z2) and the measurement variable (X1) with one another and to obtain a disturbance-compensated measurement variable (Xcomp). The MEMS device is arranged in a housing, wherein the MEMS device is in immediate mechanical contact with the housing by way of at least 50% of a MEMS device surface.
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