Packaged MEMS device with disturbance compensation

    公开(公告)号:US10921206B2

    公开(公告)日:2021-02-16

    申请号:US15999017

    申请日:2018-08-20

    Abstract: Disclosed is an apparatus which has, among other things, a MEMS device with a first measurement arrangement for capturing a measurement variable (X1) based on a physical variable, which has a useful variable component (N1) and a first disturbance variable component (Z1), and a second measurement arrangement for capturing a second disturbance variable component (Z2). The apparatus furthermore has a disturbance compensation circuit which is configured to combine the second disturbance variable component (Z2) and the measurement variable (X1) with one another and to obtain a disturbance-compensated measurement variable (Xcomp). The MEMS device is arranged in a housing, wherein the MEMS device is in immediate mechanical contact with the housing by way of at least 50% of a MEMS device surface.

    PACKAGED MEMS DEVICE WITH DISTURBANCE COMPENSATION

    公开(公告)号:US20190064026A1

    公开(公告)日:2019-02-28

    申请号:US15999017

    申请日:2018-08-20

    Abstract: Disclosed is an apparatus which has, among other things, a MEMS device with a first measurement arrangement for capturing a measurement variable (X1) based on a physical variable, which has a useful variable component (N1) and a first disturbance variable component (Z1), and a second measurement arrangement for capturing a second disturbance variable component (Z2). The apparatus furthermore has a disturbance compensation circuit which is configured to combine the second disturbance variable component (Z2) and the measurement variable (X1) with one another and to obtain a disturbance-compensated measurement variable (Xcomp). The MEMS device is arranged in a housing, wherein the MEMS device is in immediate mechanical contact with the housing by way of at least 50% of a MEMS device surface.

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