- 专利标题: Radiation-sensitive resin composition, cured film, pattern forming method, solid-state imaging device, and image display device
-
申请号: US15989408申请日: 2018-05-25
-
公开(公告)号: US10921708B2公开(公告)日: 2021-02-16
- 发明人: Yuki Nara , Kaoru Aoyagi
- 申请人: FUJIFILM Corporation
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM Corporation
- 当前专利权人: FUJIFILM Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2015-239294 20151208
- 主分类号: G03F7/031
- IPC分类号: G03F7/031 ; G03F7/029 ; G03F7/40 ; G03F7/028 ; G03F7/30 ; G03F7/004 ; G03F7/033 ; G03F7/16 ; G03F7/20 ; C08F2/50
摘要:
Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.
公开/授权文献
信息查询
IPC分类: