Invention Grant
- Patent Title: Radiation-sensitive resin composition, cured film, pattern forming method, solid-state imaging device, and image display device
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Application No.: US15989408Application Date: 2018-05-25
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Publication No.: US10921708B2Publication Date: 2021-02-16
- Inventor: Yuki Nara , Kaoru Aoyagi
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-239294 20151208
- Main IPC: G03F7/031
- IPC: G03F7/031 ; G03F7/029 ; G03F7/40 ; G03F7/028 ; G03F7/30 ; G03F7/004 ; G03F7/033 ; G03F7/16 ; G03F7/20 ; C08F2/50

Abstract:
Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.
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Information query
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