公开(公告)号：US09657182B2

公开(公告)日：2017-05-23

申请号：US14725823

申请日：2015-05-29

申请人： FUJIFILM Corporation

发明人： Toshihide Ezoe ,  Yuki Nara ,  Kazuto Shimada

IPC分类号： C09D7/00 ,  C09D7/12 ,  C09D201/00 ,  G02B5/22 ,  H04N5/225 ,  H01L27/146 ,  C09D5/00 ,  G02B1/11 ,  C08K5/55

CPC分类号： C09D7/007 ,  C08J3/22 ,  C08K5/55 ,  C09D5/00 ,  C09D7/41 ,  C09D201/00 ,  G02B1/11 ,  G02B5/223 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/13 ,  H04N5/2254

摘要： There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 μm or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.

公开(公告)号：US11953831B2

公开(公告)日：2024-04-09

申请号：US17003487

申请日：2020-08-26

申请人： FUJIFILM Corporation

发明人： Shoichi Nakamura ,  Takahiro Okawara ,  Yuki Nara

IPC分类号： G03F7/031 ,  C08K5/00 ,  C08K5/3475 ,  C08L33/14 ,  G03F7/00 ,  G03F7/008

CPC分类号： G03F7/031 ,  C08K5/0041 ,  C08K5/3475 ,  C08L33/14 ,  G03F7/0007 ,  G03F7/0085 ,  G03F7/70041 ,  C08L2203/16

摘要： Provided are a photosensitive composition for pulse exposure including: a coloring material A; a photoradical polymerization initiator B; and a radically polymerizable compound C, in which a content of a radically polymerizable compound C1 having a weight-average molecular weight of 3000 or higher is 70 mass % or higher with respect to a total mass of the radically polymerizable compound C.

公开(公告)号：US10921708B2

公开(公告)日：2021-02-16

申请号：US15989408

申请日：2018-05-25

申请人： FUJIFILM Corporation

发明人： Yuki Nara ,  Kaoru Aoyagi

IPC分类号： G03F7/031 ,  G03F7/029 ,  G03F7/40 ,  G03F7/028 ,  G03F7/30 ,  G03F7/004 ,  G03F7/033 ,  G03F7/16 ,  G03F7/20 ,  C08F2/50

摘要： Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.

公开(公告)号：US20200341374A1

公开(公告)日：2020-10-29

申请号：US16923564

申请日：2020-07-08

申请人： FUJIFILM Corporation

发明人： Takahiro OKAWARA ,  Yuki Nara ,  Shoichi Nakamura ,  Mitsuji Yoshibayashi

IPC分类号： G03F7/004 ,  G03F7/00 ,  G03F7/075

摘要： Provided is a photosensitive composition for pulse exposure including: a coloring material A; a photoinitiator B; and a compound C that is cured by reacting with an active species generated from the photoinitiator B, in which the photoinitiator B includes a photoinitiator b1 that satisfies the following condition 1.Condition 1: after a propylene glycol monomethyl ether acetate solution including 0.035 mmol/L of the photoinitiator b1 is exposed to pulses of light having a wavelength of 355 nm under conditions of maximum instantaneous illuminance: 375000000 W/m2, pulse duration: 8 nanoseconds, and frequency: 10 Hz, a quantum yield q355 is 0.05 or higher.

公开(公告)号：US09618666B2

公开(公告)日：2017-04-11

申请号：US14753189

申请日：2015-06-29

申请人： FUJIFILM Corporation

发明人： Takashi Kawashima ,  Seiichi Hitomi ,  Hidenori Takahashi ,  Yuki Nara ,  Seongmu Bak

IPC分类号： G02B5/20 ,  C07F1/08 ,  H04N5/225 ,  H04N5/33 ,  C08F2/44 ,  C08K5/42 ,  C08L63/00 ,  G02B5/22 ,  C08K5/00 ,  H01L27/146

CPC分类号： G02B5/208 ,  C07F1/08 ,  C08F2/44 ,  C08K5/0091 ,  C08K5/42 ,  C08L63/00 ,  C09D5/32 ,  G02B5/22 ,  G02B5/223 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/11 ,  H04N5/2254 ,  H04N5/332

摘要： An object of the present invention is to provide a near-infrared-absorbing composition capable of forming a cured film having excellent heat resistance while maintaining strong near-infrared shielding properties when a cured film is produced. The near-infrared-absorbing composition of the present invention includes a copper complex obtained by reacting two or more kinds of sulfonic acids represented by General Formula (I) described below or salts thereof with a copper component and a solvent.