Invention Grant
- Patent Title: Light-emitting semiconductor chip, light-emitting component and method for producing a light-emitting component
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Application No.: US16090795Application Date: 2017-04-10
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Publication No.: US10943892B2Publication Date: 2021-03-09
- Inventor: Siegfried Herrmann
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102016106571.4 20160411
- International Application: PCT/EP2017/058536 WO 20170410
- International Announcement: WO2017/178421 WO 20171019
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/52 ; H01L25/13 ; H01L33/48 ; H01L33/54 ; H01L33/58 ; H01L33/62

Abstract:
A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a light-transmissive substrate having a top surface, a bottom surface opposite the top surface, a first side and a second side surface arranged opposite the first side surface, a semiconductor body arranged on the top surface of the substrate and a contacting including a first current distribution structure and a second current distribution structure, wherein the first current distribution structure and the second current distribution structure are freely accessible from a side of the semiconductor body facing away from the substrate, and wherein the semiconductor chip, on the side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, is free of any connection point configured to electrically contact the first and second current distribution structures.
Information query
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