Invention Grant
- Patent Title: Encapsulating a bonded wire with low profile encapsulation
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Application No.: US16737279Application Date: 2020-01-08
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Publication No.: US10946658B2Publication Date: 2021-03-16
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Zhuqing Zhang
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Middleton Reutlinger
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; H01L23/00 ; H01L21/56 ; H01L21/67
Abstract:
Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
Information query
IPC分类:
