公开(公告)号：US10946658B2

公开(公告)日：2021-03-16

申请号：US16737279

申请日：2020-01-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Zhuqing Zhang

IPC: B41J2/14 ,  B41J2/16 ,  H01L23/00 ,  H01L21/56 ,  H01L21/67

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

公开(公告)号：US20160257117A1

公开(公告)日：2016-09-08

申请号：US15032022

申请日：2013-10-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Zhuqing Zhang

IPC: B41J2/14 ,  H01L21/56 ,  H01L23/00 ,  H01L21/67

CPC classification number: B41J2/1433 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/1601 ,  B41J2/1623 ,  H01L21/56 ,  H01L21/67126 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/4382 ,  H01L2224/45005 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48157 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/8592 ,  H01L2924/01004 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/00014

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract translation: 封装具有低轮廓封装的接合线包括在与第一端上的管芯连接的接合线上施加封装，并在第二端上施加封装，并截断封装形状以形成截头形状。

公开(公告)号：US20240392143A1

公开(公告)日：2024-11-28

申请号：US18685495

申请日：2021-09-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Bo Song ,  Zhuqing Zhang

IPC: C09D5/24 ,  B29C43/00 ,  B29C43/18 ,  B29C70/54 ,  B29K63/00 ,  B29K105/00 ,  B29K105/16 ,  B29K105/20 ,  B29K507/00 ,  B29K507/04 ,  B29K707/00 ,  B29L31/00 ,  C08K3/04 ,  C08K3/36 ,  C09D7/40 ,  C09D7/61 ,  C09D163/04

Abstract: An epoxy resin compound is provided. The epoxy resin compound includes a hardener, an inorganic based filler, a catalyst, and a conductive additive. The amount of inorganic based filler is greater than 80 weight percent (wt %) of the epoxy resin compound. The catalyst is to accelerate curing of the epoxy resin compound. The amount of conductive additive is 0.1 to 5 wt % of the epoxy resin compound.

公开(公告)号：US10603922B2

公开(公告)日：2020-03-31

申请号：US15542024

申请日：2015-01-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David R Otis ,  Silam J Choy ,  Kevin E Swier ,  Zhuqing Zhang

IPC: B41J2/19 ,  B41J2/175 ,  B41J2/14

Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

公开(公告)号：US20170368835A1

公开(公告)日：2017-12-28

申请号：US15542024

申请日：2015-01-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David R Otis ,  Silam J Choy ,  Kevin E Swier ,  Zhuqing Zhang

IPC: B41J2/19 ,  B41J2/14 ,  B41J2/175

CPC classification number: B41J2/19 ,  B41J2/175 ,  B41J2002/14483

Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.