An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.