Invention Grant
- Patent Title: Film forming method
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Application No.: US16216181Application Date: 2018-12-11
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Publication No.: US10961623B2Publication Date: 2021-03-30
- Inventor: Masato Koakutsu
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2017-245236 20171221
- Main IPC: C23C16/458
- IPC: C23C16/458 ; C23C16/455 ; H01L21/687 ; H01L21/67 ; H01L21/02 ; C23C16/52

Abstract:
A film forming method forms a film including a predetermined element on substrates placed on a turntable, by supplying a first reaction gas including the predetermined element from a first supply part and supplying a second reaction gas from a second supply part in a raised state of the turntable, and rotating the turntable a predetermined number of times in a state in which the separation gas is supplied from a separation gas supply part, and performs an anneal process at least before or after the film forming process, by supplying the separation gas or the second reaction gas from the first supply part and supplying the separation gas or the second reaction gas from the second supply part in a lowered state of the turntable, and rotating the turntable at least once in a state in which the separation gas is supplied from the separation gas supply part.
Public/Granted literature
- US20190194807A1 FILM FORMING METHOD Public/Granted day:2019-06-27
Information query
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