Invention Grant
- Patent Title: Stacked FinFET EEPROM
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Application No.: US16352222Application Date: 2019-03-13
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Publication No.: US10964709B2Publication Date: 2021-03-30
- Inventor: Karthik Balakrishnan , Pouya Hashemi , Tak H. Ning , Alexander Reznicek
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent L. Jeffrey Kelly
- Main IPC: H01L27/11521
- IPC: H01L27/11521 ; H01L27/11568 ; H01L27/112 ; H01L27/092 ; H01L29/78 ; H01L27/06 ; H01L27/12 ; G11C16/04 ; H01L27/11551 ; H01L29/788

Abstract:
A method for integrating a stack of fins to form an electrically erasable programmable read-only memory (EEPROM) device is presented. The method includes forming a stack of at least a first fin structure and a second fin structure over a semiconductor substrate, forming a sacrificial gate straddling the stack of at least the first fin structure and the second fin structure, forming a first conductivity type source/drain region to the first fin structure, and forming a second conductivity type source/drain to the second fin structure. The method further includes removing the sacrificial gate to form a gate opening, and forming a single floating gate in communication with a channel for each of the first and second fin structures.
Public/Granted literature
- US20190214398A1 STACKED FINFET EEPROM Public/Granted day:2019-07-11
Information query
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