- 专利标题: Semiconductor structure, HEMT structure and method of forming the same
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申请号: US16390543申请日: 2019-04-22
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公开(公告)号: US10964804B2公开(公告)日: 2021-03-30
- 发明人: Yao-Chung Chang , Po-Chih Chen , Jiun-Lei Jerry Yu , Chun Lin Tsai
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: WPAT, P.C., Intellectual Property Attorneys
- 代理商 Anthony King
- 主分类号: H01L29/778
- IPC分类号: H01L29/778 ; H01L29/20 ; H01L21/324 ; H01L29/66 ; H01L29/201 ; H01L29/51
摘要:
A semiconductor structure includes: a channel layer; an active layer over the channel layer, wherein the active layer is configured to form a two-dimensional electron gas (2DEG) to be formed in the channel layer along an interface between the channel layer and the active layer; a gate electrode over a top surface of the active layer; and a source/drain electrode over the top surface of the active layer; wherein the active layer includes a first layer and a second layer sequentially disposed therein from the top surface to a bottom surface of the active layer, and the first layer possesses a higher aluminum (Al) atom concentration compared to the second layer. An HEMT structure and an associated method are also disclosed.
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