发明授权
- 专利标题: Thermal management assemblies suitable for use with transceivers and other devices
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申请号: US16543807申请日: 2019-08-19
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公开(公告)号: US10965333B2公开(公告)日: 2021-03-30
- 发明人: Gerald R. English , Joseph C. Boetto , Woongho Bang , Leonid Lev Shmagin , Jason L. Strader , Eugene Anthony Pruss
- 申请人: Laird Technologies, Inc.
- 申请人地址: US MO Chesterfield
- 专利权人: Laird Technologies, Inc.
- 当前专利权人: Laird Technologies, Inc.
- 当前专利权人地址: US MO Chesterfield
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 代理商 Anthony G. Fussner
- 主分类号: H04B1/38
- IPC分类号: H04B1/38 ; F25B21/02 ; G02B6/42 ; H01R13/24 ; H05K5/02 ; H05K7/20 ; H01R13/6591 ; H04B1/036
摘要:
Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.