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1.发明公开公开(公告)号：US20230223315A1
公开(公告)日：2023-07-13
申请号：US18123553
申请日：2023-03-20
发明人： Jason L. STRADER , Richard F. HILL
IPC分类号： H01L23/373 , H01L23/31 , H01L23/00
CPC分类号： H01L23/373 , H01L23/3107 , H01L24/32 , H01L24/27 , H01L2224/27426 , H01L2224/32058 , H01L2224/32245 , H01L2924/16235
摘要： According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
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公开(公告)号：US11483948B2
公开(公告)日：2022-10-25
申请号：US17001815
申请日：2020-08-25
摘要： Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.
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公开(公告)号：US11439049B2
公开(公告)日：2022-09-06
申请号：US17391317
申请日：2021-08-02
发明人： Zhongliang Li , Youhong Li
IPC分类号： H05K9/00
摘要： According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.
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公开(公告)号：US20220142020A1
公开(公告)日：2022-05-05
申请号：US17577265
申请日：2022-01-17
摘要： According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.
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公开(公告)号：US20220093525A1
公开(公告)日：2022-03-24
申请号：US17481426
申请日：2021-09-22
发明人： Karen BRUZDA , John David RYAN
IPC分类号： H01L23/552 , H05K9/00 , C08K3/34 , C08K3/22 , C08L25/08
摘要： Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.
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公开(公告)号：US11083118B2
公开(公告)日：2021-08-03
申请号：US16431119
申请日：2019-06-04
发明人： Zhongliang Li , Youhong Li
IPC分类号： H05K9/00
摘要： According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.
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公开(公告)号：US20210136964A1
公开(公告)日：2021-05-06
申请号：US17144761
申请日：2021-01-08
发明人： Paul W. CROTTY, JR. , Kenneth M. ROBINSON , Joseph H. AUBIN , Zbigniew M. KORUS , Brian J. DONAHUE
IPC分类号： H05K9/00
摘要： According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.
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公开(公告)号：US10916836B2
公开(公告)日：2021-02-09
申请号：US16261356
申请日：2019-01-29
发明人： Cheikh T. Thiam , Ayman Duzdar , Reza Azadegan , Curtis W. Beaulieu , Hasan Yasin , Thomas W. Howay
摘要： According to various aspects, disclosed are exemplary embodiments of vehicular antenna assemblies. In an exemplary embodiment, a vehicular antenna assembly generally includes a first satellite antenna configured to be operable for receiving first satellite signals, and a second satellite antenna configured to be operable for receiving second satellite signals different than the first satellite signals received by the first satellite antenna. A reflector is positioned generally between the first and second satellite antennas. The reflector is configured to be operable for reflecting the first satellite signals generally towards the first satellite antenna.
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公开(公告)号：US10741471B2
公开(公告)日：2020-08-11
申请号：US16250214
申请日：2019-01-17
IPC分类号： H01L23/373 , C09K5/14 , C08L25/08 , C08J9/228 , C08J9/00 , H01L23/552
摘要： Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.
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10.发明申请公开(公告)号：US20200253096A1
公开(公告)日：2020-08-06
申请号：US16844737
申请日：2020-04-09
发明人： Douglas S. MCBAIN , Hoang Dinh DO
摘要： Disclosed are exemplary embodiments of patterned electromagnetic interference (EMI) mitigation materials (e.g., EMI absorbers, thermally-conductive EMI absorbers, etc.) including carbon nanotubes. The carbon nanotubes may comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, and/or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. For example, an EMI mitigation material may comprise a filled dielectric including a pattern of EMI absorbers. The filled dielectric comprises carbon nanotubes.
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