Invention Grant
- Patent Title: 3D printed object with embedded sensing device
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Application No.: US16462679Application Date: 2017-02-14
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Publication No.: US10967559B2Publication Date: 2021-04-06
- Inventor: Wei Huang , Lihua Zhao , Gary J. Dispoto
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Mannava & Kang
- International Application: PCT/US2017/017825 WO 20170214
- International Announcement: WO2018/151706 WO 20180823
- Main IPC: B29C64/10
- IPC: B29C64/10 ; G01N27/04 ; B33Y10/00 ; B33Y30/00 ; B33Y50/02 ; B33Y80/00 ; B29C64/393 ; B29C70/70 ; B29C70/88 ; B29L31/34

Abstract:
According to an example, a three-dimensional (3D) printed object may include a body formed of an electrically non-conductive material. In addition, an electrically conductive channel, a sensing device, and a signal emitter may be embedded within the body. The sensing device may be in electrical communication with the electrically conductive channel such that the sensing device is affected by a disruption in a current applied through the electrically conductive channel. In addition, the signal emitter may emit a wireless signal in response to the sensing device being affected by a disruption in the applied current.
Public/Granted literature
- US20190351607A1 3D PRINTED OBJECT WITH EMBEDDED SENSING DEVICE Public/Granted day:2019-11-21
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