Invention Grant
- Patent Title: Thin film treatment process
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Application No.: US16152395Application Date: 2018-10-04
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Publication No.: US10971357B2Publication Date: 2021-04-06
- Inventor: Wei Liu , Theresa Kramer Guarini , Linlin Wang , Malcolm Bevan , Johanes S. Swenberg , Vladimir Nagorny , Bernard L. Hwang , Kin Pong Lo , Lara Hawrylchak , Rene George
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A method of modifying a layer in a semiconductor device is provided. The method includes depositing a low quality film on a semiconductor substrate, and exposing a surface of the low quality film to a first process gas comprising helium while the substrate is heated to a first temperature, and exposing a surface of the low quality film to a second process gas comprising oxygen gas while the substrate is heated to a second temperature that is different than the first temperature. The electrical properties of the film are improved by undergoing the aforementioned processes.
Information query
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