Invention Grant
- Patent Title: Hybrid corrective processing system and method
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Application No.: US16154025Application Date: 2018-10-08
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Publication No.: US10971411B2Publication Date: 2021-04-06
- Inventor: Joshua LaRose , Brian D. Pfeifer , Vincent Lagana-Gizzo , Noel Russell
- Applicant: TEL Epion Inc.
- Applicant Address: US MA Billerica
- Assignee: TEL Epion Inc.
- Current Assignee: TEL Epion Inc.
- Current Assignee Address: US MA Billerica
- Agency: Wood Herron & Evans LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/66 ; H01L21/3065 ; G05B19/418
Abstract:
A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.
Public/Granted literature
- US20190043766A1 HYBRID CORRECTIVE PROCESSING SYSTEM AND METHOD Public/Granted day:2019-02-07
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