Invention Grant
- Patent Title: Bottom package with metal post interconnections
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Application No.: US14254494Application Date: 2014-04-16
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Publication No.: US10971476B2Publication Date: 2021-04-06
- Inventor: Shiqun Gu , Ratibor Radojcic , Dong Wook Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Agent Michelle S. Gallardo
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L23/31 ; H01L23/522 ; H01L23/00 ; H05K1/09 ; H05K1/11 ; H01L23/498 ; H01L25/10 ; H01L21/48 ; H01L23/538 ; H01L23/15 ; H01L23/14
Abstract:
A bottom package substrate is provided that includes a plurality of metal posts that electrically couple through a die-side redistribution layer to a plurality of die interconnects. The metal posts and the die interconnects are plated onto a seed layer on the bottom package substrate.
Public/Granted literature
- US20150235991A1 BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS Public/Granted day:2015-08-20
Information query
IPC分类:
