Invention Grant
- Patent Title: Streamlined air baffle for electronic device
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Application No.: US15895345Application Date: 2018-02-13
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Publication No.: US10973149B2Publication Date: 2021-04-06
- Inventor: Chao-Jung Chen , Yu-Nien Huang , Herman Tan , Chih-Wei Lin
- Applicant: QUANTA COMPUTER INC.
- Applicant Address: TW Taoyuan
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Taoyuan
- Agency: Nixon Peabody LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.
Public/Granted literature
- US20190116689A1 STREAMLINED AIR BAFFLE FOR ELECTRONIC DEVICE Public/Granted day:2019-04-18
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