Invention Grant
- Patent Title: Glass substrate for high-frequency device and circuit board for high-frequency device
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Application No.: US16351007Application Date: 2019-03-12
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Publication No.: US10974987B2Publication Date: 2021-04-13
- Inventor: Kazutaka Ono , Shuhei Nomura , Nobutaka Kidera , Nobuhiko Takeshita
- Applicant: AGC Inc.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2016-178512 20160913,JPJP2017-053300 20170317
- Main IPC: C03C3/089
- IPC: C03C3/089 ; C03C3/091 ; C03B25/08 ; C03B19/14 ; C03C4/16 ; H05K1/03 ; C03B17/02 ; C03B17/06 ; H05K1/02 ; C03C3/06 ; C03C3/087 ; C03C3/118 ; C03C13/04

Abstract:
The present invention relates to a glass substrate for a high-frequency device, which includes SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al2O3 and B2O3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al2O3/(Al2O3+B2O3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.
Public/Granted literature
- US20190210911A1 GLASS SUBSTRATE FOR HIGH-FREQUENCY DEVICE AND CIRCUIT BOARD FOR HIGH-FREQUENCY DEVICE Public/Granted day:2019-07-11
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