-
公开(公告)号：US20210366760A1
公开(公告)日：2021-11-25
申请号：US17398107
申请日：2021-08-10
申请人： AGC Inc.
IPC分类号： H01L21/687 , C03B33/02 , B65D85/48 , H01L21/67 , G05B1/00 , H01L23/544 , C03C27/10 , B32B17/10 , C03B33/023 , H01L21/56
摘要： A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.
-
公开(公告)号：US10759691B2
公开(公告)日：2020-09-01
申请号：US15666862
申请日：2017-08-02
申请人： AGC Inc.
发明人： Shuhei Nomura , Kazutaka Ono
IPC分类号： B32B15/04 , B32B17/06 , C03C4/08 , C03C3/085 , C03C3/087 , C03B25/02 , C03C27/00 , B32B9/04 , B32B7/12 , C03C3/091 , C03B17/06 , C03C3/093 , C03C17/25 , G02B5/20 , G02B5/22
摘要： The present invention provides a glass substrate in which in a heat treatment step of sticking a silicon substrate and a glass substrate to each other, an alkali ion is hardly diffused into the silicon substrate, and a residual strain generated in the silicon substrate is small. A glass substrate of the present invention has: an average thermal expansion coefficient α50/100 at 50° C. to 100° C. of 2.70 ppm/° C. to 3.20 ppm/° C.; an average thermal expansion coefficient α200/300 at 200° C. to 300° C. of 3.45 ppm/° C. to 3.95 ppm/° C.; a value α200/300/α50/100 obtained by dividing the average thermal expansion coefficient α200/300 at 200° C. to 300° C. by the average thermal expansion coefficient α50/100 at 50° C. to 100° C. of 1.20 to 1.30; and a content of an alkali metal oxide being 0% to 0.1% as expressed in terms of a molar percentage based on oxides.
-
公开(公告)号：US20190210911A1
公开(公告)日：2019-07-11
申请号：US16351007
申请日：2019-03-12
申请人： AGC Inc.
CPC分类号： C03C3/118 , C03B17/02 , C03B17/064 , C03C3/078 , C03C3/083 , C03C3/089 , C03C3/091 , C03C4/16 , C03C13/046 , C03C19/00 , H05K1/024 , H05K1/03
摘要： The present invention relates to a glass substrate for a high-frequency device, which includes SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al2O3 and B2O3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al2O3/(Al2O3+B2O3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.
-
公开(公告)号：US11958269B2
公开(公告)日：2024-04-16
申请号：US17575827
申请日：2022-01-14
申请人： AGC Inc.
发明人： Shuhei Ogawa , Shuhei Nomura , Norihito Nakazawa
CPC分类号： B32B17/10082 , B32B9/045 , B32B17/10 , B32B17/10036 , B32B27/28 , B32B2250/03 , B32B2307/30 , B32B2307/412 , B32B2307/546 , B32B2307/72 , B32B2307/732
摘要： A laminated member includes a glass member of which a linear transmittance at a wavelength of 850 nm is 80% or more, a bonding layer provided on or above the glass member, the bonding layer being constituted by a resin, and a Si—SiC member provided on or above the bonding layer.
-
5.发明授权公开(公告)号：US11370694B2
公开(公告)日：2022-06-28
申请号：US16195001
申请日：2018-11-19
申请人： AGC INC.
发明人： Shuhei Nomura , Kazutaka Ono
IPC分类号： B32B15/04 , B32B17/06 , C03C3/091 , C03C3/093 , H01L23/15 , B32B9/00 , H01L27/146 , H01L23/373
摘要： An alkali-free glass substrate includes, as represented by molar percentage based on oxides, 11.0% or more of Al2O3, 8.0% or more of B2O3, and 1% or more of SrO. The alkali-free glass substrate has an average coefficient of thermal expansion α100/200 at 100 to 200° C. of from 3.10 ppm/° C. to 3.70 ppm/° C., a Young's modulus of 76.0 GPa or less, and a density of 2.42 g/cm3 or more.
-
公开(公告)号：US11133215B2
公开(公告)日：2021-09-28
申请号：US15877509
申请日：2018-01-23
申请人： AGC Inc.
IPC分类号： H01L21/56 , H01L21/687 , C03B33/023 , H01L23/15 , H01L23/00 , B32B17/00 , B65D85/48 , C03B33/02 , H01L21/67 , G05B1/00 , H01L23/544 , C03C27/10 , B32B17/10
摘要： A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.
-
公开(公告)号：US12037283B2
公开(公告)日：2024-07-16
申请号：US17174615
申请日：2021-02-12
申请人： AGC Inc.
IPC分类号： C03C3/089 , C03C3/091 , C03C4/16 , H05K1/02 , H05K1/03 , C03B17/02 , C03B17/06 , C03B19/14 , C03B25/08 , C03C3/06 , C03C3/087 , C03C3/118 , C03C13/04
CPC分类号： C03C3/089 , C03C3/091 , C03C4/16 , H05K1/024 , H05K1/03 , C03B17/02 , C03B17/064 , C03B19/14 , C03B25/08 , C03C3/06 , C03C3/087 , C03C3/118 , C03C13/046 , C03C2204/08 , C03C2217/253
摘要： A glass substrate for a high-frequency device, which contains, in terms of mole percent on the basis of oxides: 40 to 75% of SiO2; 0 to 15% of Al2O3; 13 to 23% of B2O3; 2.5 to 11% of MgO; and 0 to 13% of CaO, and having a total content of alkali metal oxides in the range of 0.001-5%, where at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.
-
公开(公告)号：US11964450B2
公开(公告)日：2024-04-23
申请号：US17575843
申请日：2022-01-14
申请人： AGC Inc.
发明人： Shuhei Ogawa , Norihito Nakazawa , Shuhei Nomura
CPC分类号： B32B17/10018 , B32B9/045 , B32B17/10 , B32B18/00 , B32B27/28 , B32B2307/30 , B32B2307/412 , B32B2307/546 , B32B2307/72
摘要： A laminated member includes a glass member of which a linear transmittance at a wavelength of 850 nm is 80% or more, a bonding layer provided on or above the glass member, the bonding layer being constituted by a resin, and a ceramic member provided on or above the bonding layer, the ceramic member being constituted by an SiC member or an AlN member.
-
公开(公告)号：US11715673B2
公开(公告)日：2023-08-01
申请号：US17367762
申请日：2021-07-06
申请人： AGC Inc.
发明人： Yu Hanawa , Shigeki Sawamura , Shuhei Nomura , Kazutaka Ono , Nobuhiko Takeshita , Keisuke Hanashima
IPC分类号： B32B17/06 , H01L23/15 , C03C27/04 , C03C3/085 , C03C3/087 , C03C3/091 , C03C3/093 , B32B1/00 , B32B9/00 , C03C17/22 , H01L23/13
CPC分类号： H01L23/15 , B32B1/00 , B32B9/005 , B32B17/06 , C03C3/085 , C03C3/087 , C03C3/091 , C03C3/093 , C03C17/22 , C03C27/04 , H01L23/13 , B32B2307/30 , B32B2457/14
摘要： The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.
-
公开(公告)号：US11239549B2
公开(公告)日：2022-02-01
申请号：US17022365
申请日：2020-09-16
申请人： AGC Inc.
发明人： Shuhei Nomura , Kazutaka Ono
摘要： Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.
-
-
-
-
-
-
-
-
-
搜索结果
21 条记录 (耗时 0.015 秒)
