Invention Grant
- Patent Title: Package for optical device and optical device module
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Application No.: US16529966Application Date: 2019-08-02
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Publication No.: US10978851B2Publication Date: 2021-04-13
- Inventor: Jun Miyokawa , Masakazu Miura , Kazuki Yamaoka
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2017-025249 20170214
- Main IPC: H01S5/022
- IPC: H01S5/022 ; G02B6/42 ; H01S5/02208

Abstract:
Provided is a package for an optical device and an optical device module that can reduce or prevent damage occurrence in an optical fiber optically coupled to an optical device while ensuring a good airtightness. A package for an optical device includes a package main unit that accommodates an optical device; a pipe portion that is provided in the package main unit and through which an optical fiber optically coupled to the optical device is inserted; and a fixing portion that is provided in the package main unit and to which one end of the optical fiber is fixed, and the pipe portion includes a first pipe section having a base end fixed to the package main unit and a second pipe section joined to a tip of the first pipe section, having a higher thermal expansion coefficient than the first pipe section, to be sealed by a sealing material.
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