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    Package for optical device and optical device module
    2.
    发明授权
    Package for optical device and optical device module 有权

    公开(公告)号：US10978851B2

    公开(公告)日：2021-04-13

    申请号：US16529966

    申请日：2019-08-02

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Jun Miyokawa ,  Masakazu Miura ,  Kazuki Yamaoka

    IPC: H01S5/022 ,  G02B6/42 ,  H01S5/02208

    Abstract: Provided is a package for an optical device and an optical device module that can reduce or prevent damage occurrence in an optical fiber optically coupled to an optical device while ensuring a good airtightness. A package for an optical device includes a package main unit that accommodates an optical device; a pipe portion that is provided in the package main unit and through which an optical fiber optically coupled to the optical device is inserted; and a fixing portion that is provided in the package main unit and to which one end of the optical fiber is fixed, and the pipe portion includes a first pipe section having a base end fixed to the package main unit and a second pipe section joined to a tip of the first pipe section, having a higher thermal expansion coefficient than the first pipe section, to be sealed by a sealing material.

    Semiconductor laser module
    4.
    发明授权
    Semiconductor laser module 有权

    公开(公告)号：US11552455B2

    公开(公告)日：2023-01-10

    申请号：US16437465

    申请日：2019-06-11

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuki Yamaoka

    IPC: H01S5/50 ,  H01S5/0683 ,  G02B27/09 ,  G02B27/10 ,  G02B27/30 ,  H01S5/00 ,  H01S5/026

    Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.

    Lid portion and semiconductor laser module
    5.
    发明授权
    Lid portion and semiconductor laser module 有权

    公开(公告)号：US11367993B2

    公开(公告)日：2022-06-21

    申请号：US16985289

    申请日：2020-08-05

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Yusuke Inaba ,  Maiko Ariga ,  Kazuki Yamaoka

    IPC: H01S5/00 ,  H01S5/02251 ,  H01S5/02216 ,  H01S5/0683

    Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.

    OPTICAL COUPLING STRUCTURE BETWEEN OPTICAL FIBER AND SEMICONDUCTOR LASER
    6.
    发明申请
    OPTICAL COUPLING STRUCTURE BETWEEN OPTICAL FIBER AND SEMICONDUCTOR LASER 审中-公开

    公开(公告)号：US20180335593A1

    公开(公告)日：2018-11-22

    申请号：US16051935

    申请日：2018-08-01

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Masakazu Miura ,  Jun Miyokawa ,  Kazuki Yamaoka ,  Hajime Mori

    IPC: G02B6/42 ,  H01S5/022 ,  H01S5/024

    Abstract: A non-plated region is formed in a certain range from an end of a submount. The non-plated region is a portion where a plating layer is not provided, and thus a substrate of the submount is exposed. An intermediate layer is formed on the plating layer. Furthermore, a plating layer is formed on the intermediate layer. A semiconductor laser is formed on the plating layer. The position of an end of the semiconductor laser substantially coincides with the position of an end of the plating layer (the intermediate layer). That is, even in a case where there is a deviation between an end face of the intermediate layer and an end face of the semiconductor laser, the amount of this deviation is sufficiently smaller than the amount by which the intermediate layer is set back from an end face of the submount.

    Semiconductor laser module
    7.
    发明授权
    Semiconductor laser module 有权

    公开(公告)号：US11677210B2

    公开(公告)日：2023-06-13

    申请号：US16985277

    申请日：2020-08-05

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Yusuke Inaba ,  Maiko Ariga ,  Kazuki Yamaoka

    IPC: H01S5/02251 ,  H01S5/02253 ,  H01S5/02326

    CPC classification number: H01S5/02251 ,  H01S5/02253 ,  H01S5/02326

    Abstract: A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.

    Optical module
    9.
    发明授权
    Optical module 有权

    公开(公告)号：US11283234B2

    公开(公告)日：2022-03-22

    申请号：US16986391

    申请日：2020-08-06

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Kazuki Yamaoka ,  Maiko Ariga ,  Yusuke Inaba

    IPC: H01S5/022 ,  H01S5/02208 ,  G02B6/42 ,  H01S5/00 ,  H01S5/40 ,  H01S5/02234

    Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.

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