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    Optical coupling structure between optical fiber and semiconductor laser
    3.
    发明授权
    Optical coupling structure between optical fiber and semiconductor laser 审中-公开

    公开(公告)号：US10670819B2

    公开(公告)日：2020-06-02

    申请号：US16051935

    申请日：2018-08-01

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Masakazu Miura ,  Jun Miyokawa ,  Kazuki Yamaoka ,  Hajime Mori

    IPC: G02B6/42 ,  G02B6/26 ,  H01S5/022 ,  H01S5/0683 ,  H01S5/024

    Abstract: A non-plated region is formed in a certain range from an end of a submount. The non-plated region is a portion where a plating layer is not provided, and thus a substrate of the submount is exposed. An intermediate layer is formed on the plating layer. Furthermore, a plating layer is formed on the intermediate layer. A semiconductor laser is formed on the plating layer. The position of an end of the semiconductor laser substantially coincides with the position of an end of the plating layer (the intermediate layer). That is, even in a case where there is a deviation between an end face of the intermediate layer and an end face of the semiconductor laser, the amount of this deviation is sufficiently smaller than the amount by which the intermediate layer is set back from an end face of the submount.

    Semiconductor laser module
    4.
    发明授权
    Semiconductor laser module 有权

    公开(公告)号：US10566761B2

    公开(公告)日：2020-02-18

    申请号：US15867833

    申请日：2018-01-11

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Masakazu Miura ,  Jun Miyokawa ,  Kazuki Yamaoka ,  Toshio Kimura

    IPC: G02B6/42 ,  H01S5/022 ,  H01S5/024

    Abstract: A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.

    Optical fiber fixing structure
    5.
    发明授权
    Optical fiber fixing structure 有权

    公开(公告)号：US10551576B2

    公开(公告)日：2020-02-04

    申请号：US15416619

    申请日：2017-01-26

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Kazuki Yamaoka ,  Jun Miyokawa ,  Masakazu Miura ,  Toshio Kimura

    IPC: G02B6/00 ,  G02B6/42 ,  G02B6/27 ,  G02F1/01 ,  G02B6/38

    Abstract: An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is −22.5° to 22.5°, or 67.5° to 112.5°.

    Package for optical device and optical device module
    8.
    发明授权
    Package for optical device and optical device module 有权

    公开(公告)号：US10978851B2

    公开(公告)日：2021-04-13

    申请号：US16529966

    申请日：2019-08-02

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Jun Miyokawa ,  Masakazu Miura ,  Kazuki Yamaoka

    IPC: H01S5/022 ,  G02B6/42 ,  H01S5/02208

    Abstract: Provided is a package for an optical device and an optical device module that can reduce or prevent damage occurrence in an optical fiber optically coupled to an optical device while ensuring a good airtightness. A package for an optical device includes a package main unit that accommodates an optical device; a pipe portion that is provided in the package main unit and through which an optical fiber optically coupled to the optical device is inserted; and a fixing portion that is provided in the package main unit and to which one end of the optical fiber is fixed, and the pipe portion includes a first pipe section having a base end fixed to the package main unit and a second pipe section joined to a tip of the first pipe section, having a higher thermal expansion coefficient than the first pipe section, to be sealed by a sealing material.

    Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber
    9.
    发明授权
    Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber 有权

    公开(公告)号：US10101547B2

    公开(公告)日：2018-10-16

    申请号：US14742600

    申请日：2015-06-17

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Jun Miyokawa

    IPC: G02B6/42 ,  H01S5/022 ,  H01S5/00

    Abstract: This fixing structure for an optical fiber comprises a groove provided to a fiber-fixing base along the axial direction of an optical fiber to be fixed. The groove opens upward. The optical fiber is arranged within the groove along the groove. The optical fiber is fixed to the inner surface of the groove using an adhesive. The inner-side surfaces of the groove that face each other serve as fixing surfaces for the optical fiber. In other words, the optical fiber is fixed to the fixing surfaces that are the inner-side surfaces of the groove and that face each other using the adhesive. A space in which the fiber-fixing base and the adhesive are not bonded is formed in the vertical direction of the optical fiber. In other words, a space is provided in a vertical direction that is substantially perpendicular to the fixing direction in which the optical fiber is fixed.

    OPTICAL COUPLING STRUCTURE BETWEEN OPTICAL FIBER AND SEMICONDUCTOR LASER
    10.
    发明申请
    OPTICAL COUPLING STRUCTURE BETWEEN OPTICAL FIBER AND SEMICONDUCTOR LASER 审中-公开

    公开(公告)号：US20180335593A1

    公开(公告)日：2018-11-22

    申请号：US16051935

    申请日：2018-08-01

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Masakazu Miura ,  Jun Miyokawa ,  Kazuki Yamaoka ,  Hajime Mori

    IPC: G02B6/42 ,  H01S5/022 ,  H01S5/024

    Abstract: A non-plated region is formed in a certain range from an end of a submount. The non-plated region is a portion where a plating layer is not provided, and thus a substrate of the submount is exposed. An intermediate layer is formed on the plating layer. Furthermore, a plating layer is formed on the intermediate layer. A semiconductor laser is formed on the plating layer. The position of an end of the semiconductor laser substantially coincides with the position of an end of the plating layer (the intermediate layer). That is, even in a case where there is a deviation between an end face of the intermediate layer and an end face of the semiconductor laser, the amount of this deviation is sufficiently smaller than the amount by which the intermediate layer is set back from an end face of the submount.

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