Disclosed are a substrate treating apparatus and a method for inspecting a treatment liquid nozzle. The substrate treating apparatus includes a support member configured to support a substrate, a treatment liquid nozzle configured to discharge a treatment liquid to the substrate located on the support member, a light source configured to irradiate light to a point of the substrate, to which the treatment liquid is discharged, a camera configured to photograph the point of the substrate, to which the treatment liquid is discharged, and a controller configured to determine, through an image captured by the camera, whether a crown is generated when the treatment liquid collides with the substrate.