Invention Grant
- Patent Title: Electronic package that includes lamination layer
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Application No.: US15778042Application Date: 2015-11-24
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Publication No.: US10985080B2Publication Date: 2021-04-20
- Inventor: Pramod Malatkar , Kyle Yazzie , Naga Sivakumar Yagnamurthy , Richard J. Harries , Dilan Seneviratne , Praneeth Akkinepally , Xuefei Wan , Yonggang Li , Robert L. Sankman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2015/062397 WO 20151124
- International Announcement: WO2017/091211 WO 20170601
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/34 ; H01L23/48 ; H01L25/10 ; H01L23/00 ; H01L23/498 ; H01L23/538
Abstract:
An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.
Public/Granted literature
- US20180350709A1 ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER Public/Granted day:2018-12-06
Information query
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