Invention Grant
- Patent Title: Systems and methods for forming die sets with die-to-die routing and metallic seals
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Application No.: US16583082Application Date: 2019-09-25
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Publication No.: US10985107B2Publication Date: 2021-04-20
- Inventor: Sanjay Dabral , Jun Zhai
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; H01L23/538 ; H01L23/488 ; H01L23/00 ; H01L25/18 ; H01L21/66 ; H01L23/522 ; H01L23/528 ; H01L23/58 ; H01L23/498

Abstract:
Stitched die structures, and methods for interconnecting die are described. In an embodiment, a stitched die structure includes a semiconductor substrate that includes a first die area of a first die and a second die area of a second die separate from the first die area. A back-end-of-the-line (BEOL) build-up structure spans over the first die area and the second die area, and includes a first metallic seal directly over a first peripheral area of the first die area, a second metallic seal directly over a second peripheral area of the second die area, and a die-to-die routing extending through the first metallic seal and the second metallic seal to electrically connect the first die to the second die.
Public/Granted literature
- US20200075497A1 SYSTEMS AND METHODS FOR INTERCONNECTING DIES Public/Granted day:2020-03-05
Information query
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