A stiffener on a semiconductor package substrate includes a plurality of parts that are electrically coupled to the semiconductor package substrate on a die side. Both stiffener parts are electrically contacted through a passive device that is soldered between the two stiffener parts and by an electrically conductive adhesive that bonds a given stiffener part to the semiconductor package substrate. The passive device is embedded between two stiffener parts to create a smaller X-Y footprint as well as a lower Z-direction profile.