Invention Grant
- Patent Title: Methods of forming resistive memory elements
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Application No.: US16552745Application Date: 2019-08-27
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Publication No.: US10991882B2Publication Date: 2021-04-27
- Inventor: Christopher W. Petz , Yongjun Jeff Hu , Scott E. Sills , D. V. Nirmal Ramaswamy
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/52
- IPC: H01L23/52 ; G11C13/00 ; H01L45/00 ; H01L27/24 ; H01L23/522 ; H01L27/22 ; C23C14/06 ; C23C14/08 ; C23C14/18 ; C23C14/34 ; C23C16/34 ; C23C16/36 ; C23C16/40 ; C23C16/455

Abstract:
A resistive memory element comprises a first electrode, an active material over the first electrode, a buffer material over the active material and comprising longitudinally extending, columnar grains of crystalline material, an ion reservoir material over the buffer material, and a second electrode over the ion reservoir material. A memory cell, a memory device, an electronic system, and a method of forming a resistive memory element are also described.
Public/Granted literature
- US20200013955A1 METHODS OF FORMING RESISTIVE MEMORY ELEMENTS Public/Granted day:2020-01-09
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