- Patent Title: Encapsulating structure capable of securing barrier characteristics with reduced thickness, display device having encapsulating structure and method of manufacturing the same
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Application No.: US16199848Application Date: 2018-11-26
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Publication No.: US10991913B2Publication Date: 2021-04-27
- Inventor: Choelmin Jang , Sunghun Key , Junggon Kim , Myungsoo Huh
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0013084 20180201
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L51/52 ; H01L51/56 ; H01L27/32

Abstract:
Provided are an encapsulating structure, an organic light-emitting display device including the encapsulating structure, and a method of manufacturing the same. The encapsulating structure includes a first barrier layer including a first inorganic layer having a first thickness; a plasma polymer layer on the first inorganic layer, the plasma polymer layer having a second thickness smaller than or equal to the first thickness; and a second barrier layer including at least one second inorganic layer on the plasma polymer layer. The at least one second inorganic layer has a third thickness, and the third thickness is smaller than or equal to the second thickness.
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