Invention Grant
- Patent Title: Device for removing portion of cover and method of removing portion of cover
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Application No.: US16741765Application Date: 2020-01-14
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Publication No.: US10993358B1Publication Date: 2021-04-27
- Inventor: Chi-Shiang Chen , Bo-Han Li
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: TW108142790 20191125
- Main IPC: B32B43/00
- IPC: B32B43/00 ; H05K13/04 ; H05K3/46 ; B32B38/10

Abstract:
A device for removing a portion of cover is provided, which includes a lower platform and an upper platform oppositely disposed, a cover jig between the lower and upper platforms, a feed roller and a receiving roller oppositely disposed, and an adhesive film. The upper platform includes a plurality of protrusions, and each of the protrusions extends toward the lower platform. The cover jig includes a plurality of through holes, and each of the through holes is disposed opposite to each of the protrusions, so that each of the protrusions can be inserted through each of the through holes. One end of the adhesive film is connected to the feed roller, and the other end of the adhesive film is connected to the receiving roller, and a portion of the adhesive film between the two ends is located between the upper platform and the cover jig.
Information query