Invention Grant
- Patent Title: Methods for producing transparent conductive film and transparent conductive pattern
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Application No.: US16477614Application Date: 2018-01-15
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Publication No.: US10994303B2Publication Date: 2021-05-04
- Inventor: Shigeru Yamaki
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-004852 20170116
- International Application: PCT/JP2018/000780 WO 20180115
- International Announcement: WO2018/131702 WO 20180719
- Main IPC: B05D5/00
- IPC: B05D5/00 ; B05D5/12 ; B05D7/04 ; C09D11/037 ; C09D11/52 ; H01B13/00

Abstract:
Methods for producing a transparent conductive film and transparent conductive pattern having superior in-plane uniformity of resistance, by a printing method of slit coating or roll coating of metal nanowire ink. The methods include applying a metal nanowire ink containing metal nanowires, a binder resin containing more than 50 mol % monomer units derived from N-vinylacetamide, and a solvent, to at least one surface of a transparent resin film and drying to form a transparent conductive layer, the application of the metal nanowire ink to the transparent resin film being application by slit coating or roll coating performed using a transparent resin film and metal nanowire ink with which the advancing angle (θa) of the dynamic contact angle of the metal nanowire ink relative to the transparent resin film satisfies 10.0°
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