Invention Grant
- Patent Title: Method of etch model calibration using optical scatterometry
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Application No.: US16741735Application Date: 2020-01-13
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Publication No.: US10997345B2Publication Date: 2021-05-04
- Inventor: Ye Feng , Marcus Musselman , Andrew D. Bailey, III , Mehmet Derya Tetiker , Saravanapriyan Sriraman , Yan Zhang , Julien Mailfert
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: G06F30/367
- IPC: G06F30/367 ; G03F1/36 ; G03F1/78 ; G03F1/86 ; G03F1/80

Abstract:
Computer-implemented methods of optimizing a process simulation model that predicts a result of a semiconductor device fabrication operation to process parameter values characterizing the semiconductor device fabrication operation are disclosed. The methods involve generating cost values using a computationally predicted result of the semiconductor device fabrication operation and a metrology result produced, at least in part, by performing the semiconductor device fabrication operation in a reaction chamber operating under a set of fixed process parameter values. The determination of the parameters of the process simulation model may employ pre-process profiles, via optimization of the resultant post-process profiles of the parameters against profile metrology results. Cost values for, e.g., optical scatterometry, scanning electron microscopy and transmission electron microscopy may be used to guide optimization.
Public/Granted literature
- US20200218844A1 METHOD OF ETCH MODEL CALIBRATION USING OPTICAL SCATTEROMETRY Public/Granted day:2020-07-09
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