Invention Grant
- Patent Title: Electrical contact material, method of producing an electrical contact material, and terminal
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Application No.: US15363518Application Date: 2016-11-29
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Publication No.: US10998108B2Publication Date: 2021-05-04
- Inventor: Yoshikazu Okuno , Yoshiaki Kobayashi , Tatsuya Nakatsugawa , Kengo Mitose , Akira Tachibana , Shingo Kawata
- Applicant: FURUKAWA ELECTRIC CO., LTD. , FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Applicant Address: JP Tokyo; JP Shiga
- Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee Address: JP Tokyo; JP Shiga
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2014-112973 20140530
- Main IPC: H01B1/02
- IPC: H01B1/02 ; C25D5/12 ; H01H1/025 ; B21D53/00 ; H01H1/04 ; C25D5/50 ; B32B15/01 ; C22F1/10 ; C25D5/34 ; C25D7/00 ; C22F1/08 ; C22F1/16 ; C25D3/12 ; C25D3/30 ; C25D3/38

Abstract:
An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μm2 or less; a method of producing the same; and a terminal.
Public/Granted literature
- US20170076834A1 ELECTRICAL CONTACT MATERIAL, METHOD OF PRODUCING AN ELECTRICAL CONTACT MATERIAL, AND TERMINAL Public/Granted day:2017-03-16
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