Invention Grant
- Patent Title: Gapfill using reactive anneal
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Application No.: US15946107Application Date: 2018-04-05
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Publication No.: US11011384B2Publication Date: 2021-05-18
- Inventor: Abhijit Basu Mallick , Pramit Manna , Shishi Jiang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/36 ; H01L21/20 ; H01L21/205 ; H01L21/3105 ; H01L21/02
Abstract:
Methods for seam-less gapfill comprising forming a flowable film by PECVD, annealing the flowable film with a reactive anneal to form an annealed film and curing the flowable film or annealed film to solidify the film. The flowable film can be formed using a higher order silane and plasma. The reactive anneal may use a silane or higher order silane. A UV cure, or other cure, can be used to solidify the flowable film or the annealed film.
Public/Granted literature
- US20180294166A1 Gapfill Using Reactive Anneal Public/Granted day:2018-10-11
Information query
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