Invention Grant
- Patent Title: Electronic component guard ring
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Application No.: US16707188Application Date: 2019-12-09
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Publication No.: US11018097B2Publication Date: 2021-05-25
- Inventor: Hongbin Zhu , Minsoo Lee , Gordon A. Haller , Philip J. Ireland
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law, PC
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/532 ; H01L21/3065 ; H01L21/3205 ; H01L23/00

Abstract:
Guard ring technology is disclosed. In one example, an electronic component guard ring can include a barrier having a first barrier portion and a second barrier portion oriented end to end to block ion diffusion and crack propagation in an electronic component. The guard ring can also include an opening in the barrier between the first and second barrier portions extending between a first side and a second side of the barrier. Associated systems and methods are also disclosed.
Information query
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