Invention Grant
- Patent Title: Reduction of metal resistance in vertical ReRAM cells
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Application No.: US16741786Application Date: 2020-01-14
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Publication No.: US11018192B2Publication Date: 2021-05-25
- Inventor: Takashi Ando , Pouya Hashemi , Choonghyun Lee
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Randall Bluestone
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
Embodiments of the invention include resulting structures and a method for fabricating a vertical ReRAM array structure. The embodiments of the invention include forming alternating layers over a metal layer of a structure, wherein a layer of the alternating layers comprises a low resistivity material, masking one or more portions of a topmost layer of the alternating layers, and etching one or more portions of the alternating layers down to the metal layer. Embodiments of the invention also include depositing a lateral electrode layer over the etched one or more portions of the alternating layers, performing an etch back on the lateral electrode layer, and forming a vertical electrode layer over the structures.
Public/Granted literature
- US20200152702A1 REDUCTION OF METAL RESISTANCE IN VERTICAL RERAM CELLS Public/Granted day:2020-05-14
Information query
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