Invention Grant
- Patent Title: Polymer substrate with hardcoat layer, and manufacturing method for same
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Application No.: US15761348Application Date: 2016-09-23
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Publication No.: US11028284B2Publication Date: 2021-06-08
- Inventor: Tatsuya Ekinaka , Tatsuichirou Kon , Takehiro Suga , Hiroshi Kishimoto , Yume Morita , Satoshi Ogata , Masato Nakagomi
- Applicant: TEIJIN LIMITED , TSUKISHIMA KIKAI CO., LTD.
- Applicant Address: JP Osaka; JP Tokyo
- Assignee: TEIJIN LIMITED,TSUKISHIMA KIKAI CO., LTD.
- Current Assignee: TEIJIN LIMITED,TSUKISHIMA KIKAI CO., LTD.
- Current Assignee Address: JP Osaka; JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2015-189003 20150925
- International Application: PCT/JP2016/078127 WO 20160923
- International Announcement: WO2017/051914 WO 20170330
- Main IPC: C09D133/12
- IPC: C09D133/12 ; B32B9/00 ; B32B7/02 ; C09D7/40 ; C23C16/509 ; C23C16/02 ; C23C16/40 ; C08J7/04 ; C23C28/00 ; C09D7/62 ; C09D133/10 ; C23C16/42 ; C23C16/50 ; C23C16/56

Abstract:
The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 μm, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 μm; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.975 in a 3-point bending test of the polymer substrate with a hardcoat layer having been subjected to indentation deformation that causes the surface on which the silicon oxide layer is layered to be indented.
Public/Granted literature
- US20180265731A1 POLYMER SUBSTRATE WITH HARDCOAT LAYER, AND MANUFACTURING METHOD FOR SAME Public/Granted day:2018-09-20
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