Invention Grant
- Patent Title: Fluid ejection die heat exchangers
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Application No.: US16483101Application Date: 2017-04-05
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Publication No.: US11046073B2Publication Date: 2021-06-29
- Inventor: Chien-Hua Chen , Michael W Cumbie , James R Przybyla
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- International Application: PCT/US2017/026049 WO 20170405
- International Announcement: WO2018/186844 WO 20181011
- Main IPC: B41J29/377
- IPC: B41J29/377 ; B41J2/16 ; B41J2/14 ; B41J2/175

Abstract:
A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.
Public/Granted literature
- US20200238695A1 FLUID EJECTION DIE HEAT EXCHANGERS Public/Granted day:2020-07-30
Information query
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