Invention Grant
- Patent Title: Semiconductor device having fin structures
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Application No.: US16908441Application Date: 2020-06-22
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Publication No.: US11056594B2Publication Date: 2021-07-06
- Inventor: Yu-Kuan Lin , Chang-Ta Yang , Ping-Wei Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L21/02 ; H01L21/308 ; H01L21/8238

Abstract:
A semiconductor device structure is provided. The structure includes a semiconductor substrate having a well pick-up region and an active region adjacent to the well pick-up region. The semiconductor device structure also includes a first fin structure with a first width and a third fin structure with a third width formed adjacent to each other in the well pick-up region and a second fin structure with a second width and a fourth fin structure with a fourth width formed adjacent to each other in the active region. The first width is different than the second width, the third width is different than the fourth width, and the first width is substantially equal to or greater than the third width.
Public/Granted literature
- US20200335620A1 SEMICONDUCTOR DEVICE HAVING FIN STRUCTURES Public/Granted day:2020-10-22
Information query
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