Invention Grant
- Patent Title: Insulated gate power semiconductor device and method for manufacturing such a device
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Application No.: US16157435Application Date: 2018-10-11
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Publication No.: US11075285B2Publication Date: 2021-07-27
- Inventor: Luca De-Michielis , Chiara Corvasce
- Applicant: ABB Power Grids Switzerland AG
- Applicant Address: CH Baden
- Assignee: ABB Power Grids Switzerland AG
- Current Assignee: ABB Power Grids Switzerland AG
- Current Assignee Address: CH Baden
- Agency: Slater Matsil, LLP
- Priority: EP16164709 20160411
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L29/06 ; H01L29/10 ; H01L29/78 ; H01L21/225 ; H01L21/265 ; H01L29/08 ; H01L21/266

Abstract:
An insulated gate power semiconductor device includes an (n-) doped drift layer between an emitter side and a collector side. A p doped protection pillow covers a trench bottom of a trench gate electrode. An n doped enhancement layer having a maximum enhancement layer doping concentration in an enhancement layer depth separates the base layer from the drift layer. An n doped plasma enhancement layer having a maximum plasma enhancement layer doping concentration covers an edge region between the protection pillow and the trench gate electrode. The N doping concentration decreases from the maximum enhancement layer doping concentration towards the plasma enhancement layer and the N doping concentration decreases from the maximum plasma enhancement layer doping concentration towards the enhancement layer such that the N doping concentration has a local doping concentration minimum between the enhancement layer and the plasma enhancement layer.
Public/Granted literature
- US20190123172A1 INSULATED GATE POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE Public/Granted day:2019-04-25
Information query
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