Invention Grant
- Patent Title: Electronic package
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Application No.: US16554952Application Date: 2019-08-29
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Publication No.: US11081776B2Publication Date: 2021-08-03
- Inventor: Ying-Wei Lu , Bo-Siang Fang , Kuan-Ta Chen , Chia-Chu Lai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW108124508 20190711
- Main IPC: H01Q1/22
- IPC: H01Q1/22
Abstract:
An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.
Public/Granted literature
- US20210013583A1 ELECTRONIC PACKAGE Public/Granted day:2021-01-14
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