公开(公告)号：US12100633B2

公开(公告)日：2024-09-24

申请号：US18214969

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US12014967B2

公开(公告)日：2024-06-18

申请号：US18215113

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US20230343663A1

公开(公告)日：2023-10-26

申请号：US18214969

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US20200304165A1

公开(公告)日：2020-09-24

申请号：US16843386

申请日：2020-04-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Ying-Wei Lu ,  Chia-Chu Lai ,  Cheng-Tsai Hsieh

IPC: H04B1/48 ,  H04B1/7085 ,  G01S13/40 ,  H04B1/04 ,  G01S13/32

Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.

公开(公告)号：US20190319347A1

公开(公告)日：2019-10-17

申请号：US16044154

申请日：2018-07-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Chia-Chu Lai ,  Ying-Wei Lu

IPC: H01Q1/38 ,  H01Q1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/66

Abstract: An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.

公开(公告)号：US20230386992A1

公开(公告)日：2023-11-30

申请号：US18234695

申请日：2023-08-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang

IPC: H01L23/522 ,  H01L23/31

CPC classification number: H01L23/5223 ,  H01L28/40 ,  H01L23/31 ,  H01L23/5226

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

公开(公告)号：US20230343665A1

公开(公告)日：2023-10-26

申请号：US18215113

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US20200052393A1

公开(公告)日：2020-02-13

申请号：US16232840

申请日：2018-12-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Chia-Chu Lai

IPC: H01Q1/38 ,  H01Q23/00

Abstract: An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.

公开(公告)号：US09698090B2

公开(公告)日：2017-07-04

申请号：US13753882

申请日：2013-01-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Shiang Fang ,  Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang ,  Li-Fang Lin

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/14 ,  H01L23/13 ,  H01L21/768

CPC classification number: H01L23/49827 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/19011 ,  H01L2924/00

Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

公开(公告)号：US09281557B2

公开(公告)日：2016-03-08

申请号：US14090787

申请日：2013-11-26

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chia-Chu Lai ,  Min-Han Chuang ,  Bo-Shiang Fang ,  Ho-Chuan Lin ,  Li-Fang Lin

IPC: H01Q1/50 ,  H03H5/00 ,  H03H7/42

CPC classification number: H01Q1/50 ,  H03H7/425

Abstract: A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.

Abstract translation: 提供了一种多频带平衡 - 不平衡变压器，包括主信号端口，电连接到主信号端口的主电感器，与主电感器相互感应的第一电感器，以构成第一转换电路的第一电感器;第一电容器模块， 与第一转换电路平行的两个第一信号端口电连接到第一电容器模块，电连接到第一信号端口和第一电容器模块之间的第一主电容器，与主电感器相互感应的第二电感器，以构成第二电容器 第二转换电路的电感器，与第二转换电路并联连接的第二电容器模块，电连接到第二电容器模块的两个第二信号端口，以及与第二信号端口和第二电容器模块电连接的第二主电容器 。