Invention Grant
- Patent Title: Laser microdissection method and laser microdissection systems
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Application No.: US16310825Application Date: 2017-06-27
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Publication No.: US11085855B2Publication Date: 2021-08-10
- Inventor: Falk Schlaudraff , Andrew K. Lee
- Applicant: LEICA MICROSYSTEMS CMS GMBH
- Applicant Address: DE Wetzlar
- Assignee: LEICA MICROSYSTEMS CMS GMBH
- Current Assignee: LEICA MICROSYSTEMS CMS GMBH
- Current Assignee Address: DE Wetzlar
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: DE102016111938.5 20160629
- International Application: PCT/EP2017/065788 WO 20170627
- International Announcement: WO2018/002011 WO 20180104
- Main IPC: G01N1/28
- IPC: G01N1/28 ; G01J1/42 ; G02B21/08 ; A61B18/20

Abstract:
A method for performing a laser microdissection for cutting a dissectate from a specimen using a laser includes the step of providing the specimen in a light path of an illumination system. The specimen is illuminated by the illumination system. A detector detects light emanating from the specimen. The light detected by the detector is analyzed. It is determined, based on the analysis of the light detected by the detector, whether a receptacle for collecting the dissectate is disposed in a predetermined collection position, at which the dissectate is to be collected in the receptacle after it is cut from the specimen. Laser cutting of the dissectate from the specimen is initiated based on it having been determined that the receptacle is in the predetermined collection position.
Public/Granted literature
- US20200309648A1 LASER MICRODISSECTION METHOD AND LASER MICRODISSECTION SYSTEMS Public/Granted day:2020-10-01
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